HMDS烘箱

（HMDS Oven）

主要用途/ Application：

HMDS Oven 是一种专用于基材表面处理的设备，主要用于提高光刻胶在基材表面的附着力。其核心功能是通过气相沉积的方式将六甲基二硅氮烷（HMDS）分子吸附到基材表面，形成一层亲有机的界面。适用的用途包括：

1. 光刻前基材表面处理： 提高硅、玻璃、氧化硅等材料表面对光刻胶的附着力，减少图案剥落。
2. 改善工艺可靠性： 尤其适用于微电子、MEMS 和光电器件的制造工艺中对高附着力的要求。
3. 处理各种基材： 如晶圆、玻璃片或其他需要增强附着性能的基材表面处理。

The HMDS Oven is a specialized device for substrate surface treatment, primarily used to enhance photoresist adhesion to substrates. Its core function is to deposit hexamethyldisilazane (HMDS) molecules onto substrate surfaces via vapor-phase deposition, creating an organophilic interface layer. Applications include:

1. Pre-photolithography Substrate Treatment: Enhancing adhesion of photoresist on silicon, glass, silicon dioxide, and similar materials, reducing pattern delamination.
2. Improving Process Reliability: Particularly suitable for microelectronics, MEMS, and optoelectronic devices where high adhesion is critical.
3. Processing Various Substrates: Effective for wafers, glass plates, or any surfaces requiring improved adhesion properties.

 

设备工作原理简介/ Operating principle：

HMDS Oven 的工作原理基于气相沉积和表面化学改性：

1. 基材预处理： 在 HMDS 处理前，基材通常需要通过干燥或等离子清洗去除表面的水分和污染物。
2. HMDS 蒸发： 设备内通过加热 HMDS 溶剂产生气相，使其均匀分布于处理腔体中。
3. 化学吸附反应： HMDS 与基材表面的羟基（OH）发生化学反应，形成一层硅氧化物与有机基团结合的界面层，使表面从亲水性转为亲有机性。
4. 温度与时间控制： 设备精确控制腔体内的温度（通常为120-150°C）和处理时间，以确保均匀的表面修饰。
5. 快速干燥： 处理后，基材快速干燥，准备进入下一步光刻工艺。

这种设备可以显著提升光刻图案的质量和稳定性，是半导体和光电领域的重要辅助工具。

The HMDS Oven operates based on vapor-phase deposition and surface chemical modification:

1. Substrate Pre-treatment: Before HMDS treatment, substrates are typically cleaned or dried to remove surface moisture and contaminants.
2. HMDS Vaporization: The device heats HMDS solvent to generate vapor, ensuring uniform distribution within the processing chamber.
3. Chemical Adsorption Reaction: HMDS reacts with hydroxyl (OH) groups on the substrate surface, forming a siloxane-based interface layer that transitions the surface from hydrophilic to organophilic.
4. Temperature and Time Control: The chamber’s temperature (typically 120-150°C) and processing time are precisely controlled to ensure uniform surface modification.
5. Rapid Drying: After treatment, the substrate is quickly dried and ready for subsequent photolithography steps.

This equipment significantly improves the quality and stability of photolithographic patterns, making it an essential tool in semiconductor and optoelectronic industries.

 

工艺能力/ Capability：

• 温度范围25°C至200°C
• 使用HMDS填充腔室
• HMDS 在晶圆表面形成一层疏水涂层，去除水分，增强光刻胶与基底（如硅、玻璃等）的附着力
• 兼容不同尺寸的晶圆（最大8 英寸），适合多种工艺应用

 

• Temp. range approx. >5°C to 200°C
• Temp. variation at 50/150°C (±°C): 1.0/2.6°C
• Temp. fluctuation at 100°C (±°C): 0.2°C
• Dynamic regulation and improved energy efficiency
• Real-time clock with process times
• Uniform temperature through mantle heating
• Safety class 3.3
• USB and RJ45 interface
• Ambient temperature probe
• Cabinet made of PP light grey RAL 7035, easy to clean

 

典型使用案例/ Typical scenario：

设备类别/Facilities：光刻辅助设备/ Lithography Misc

设备编号/No.：EDD2HMD01

设备地点/Location：东区显影Ⅱ区/ East Developing Area II

 

工艺工程师/Engineer in response:

姓名：张笛；邮箱：captianzhangdi@sjtu.edu.cn；电话：13651735947

Name: Di Zhang；Email：captianzhangdi@sjtu.edu.cn; Tel: 13651735947.

设备照片/Photos：