维开双腔电子束蒸发镀膜系统
(Vikaitech dual chamber electron beam evaporation coating system)
主要用途/ Application:
满足常温条件下沉积高质量、厚度精确可控制的金属单质(尤其是难熔的Pt、Pd等贵金属)及化合物等多种薄膜。金属薄膜如Cr、Cu、Ni、Al、Y、Ti、Pt、Pd等
The equipment is capable of depositing high-quality, precisely controllable thickness metal elements (especially refractory precious metals such as Pt and Pd) and various compounds such as Cr, Cu, Ni, Al, Y, Ti, Pt, Pd, and other metal films at room temperature
设备工作原理简介/ Operating principle:
利用钨灯丝发射的热电子经阴极与阳极间的高压电场加速并聚焦,由磁场使之偏转到达坩埚待蒸发材料表面,轰击材料引起晶格振动,释放热量,直至材料熔化或升华,将材料蒸发沉积。
The device uses the hot electrons emitted by tungsten filaments to be accelerated and focused by the high-voltage electric field between the cathode and anode, and then deflected by the magnetic field to reach the surface of the material to be evaporated in the crucible. The bombardment of the material causes lattice vibration and releases heat until the material melts or sublimates, resulting in the evaporation and deposition of the material.
工艺能力/ Capability:
1.满足8英寸以下的样品蒸镀薄膜
2.膜厚精度在5nm@100nm
3.最大沉积薄膜厚度3um
4.工件台温度室温
5.样品厚度不超过5mm
6.沉积薄膜的种类主要有Cr, Cu, Ni, Al, Y, Ti, Pt, Pd
1.Samples below 8 inches
2.The accuracy of film thickness is 5nm@100nm
3.Maximum deposited film thickness of 3um
4.Workpiece table temperature: Room temperature
5.The sample thickness shall not exceed 5mm
6.The main types of deposited films are Cr, Cu, Ni, Al, Y, Ti, Pt, Pd
典型使用案例/ Typical scenario:
剥离工艺
lift-off
设备类别/Facilities:薄膜沉积设备/ Thin Film Deposition Equipment
设备编号/No.:EFM3EBE01
设备地点/Location:东区薄膜III区/ East Thin Film Area III
工艺工程师/Engineer in response:
姓名:付学成;邮箱:xuecheng.f@sjtu.edu.cn;电话:34206126-6010
Name: XueCheng Fu;Email:xuecheng.f@sjtu.edu.cn; Tel: 34206126-6010.
设备照片/Photos: