维开电阻热蒸发镀膜系统

（Vikaitech resistance Heating Evaporation）

主要用途/ Application：

设备支持8英寸以下样品的加工、满足常温条件下沉积高质量的金膜、SiO2、MgF2、WO3、ZnS等化合物薄膜。蒸镀薄膜的厚度不超过500nm。

This device supports the processing of samples under 8 inches and can deposit high-quality gold films, SiO2, MgF2, WO3, ZnS and other compound films at room temperature. The thickness of the vapor deposited film shall not exceed 500nm.

设备工作原理简介/ Operating principle：

电阻加热蒸发，它利用电阻加热蒸发材料的技术，通过将蒸发材料放入适当形状的电阻加热体内，通电使其直接加热蒸发，或者将蒸发材料放入坩埚中进行间接加热蒸发。

Resistance heating evaporation utilizes the technology of resistance heating evaporation materials. By placing the evaporation material into an appropriately shaped resistance heating body and applying electricity, it can be directly heated and evaporated, or indirectly heated and evaporated by placing the evaporation material in a crucible.

工艺能力/ Capability：

1.支持8英寸以下的样品加工；样品厚度不要超过5mm

2.支持蒸镀SiO2、MgF2、Al2O3等介质薄膜

3.膜厚精度在5nm@100nm

4.最大沉积薄膜厚度500nm

5.工件台的温度是室温

1.Support sample processing for sizes below 8 inches; The sample thickness should not exceed 5mm

2.Support vapor deposition of dielectric films such as SiO2, MgF2, Al2O3, etc

3.The accuracy of film thickness is 5nm@100nm

4.Maximum deposited film thickness of 500nm

5.The temperature of the workpiece table is room temperature

典型使用案例/ Typical scenario：

蒸镀光学薄膜

Vapor deposited optical thin film

设备类别/Facilities：薄膜沉积设备/ Thin Film Deposition Equipment

设备编号/No.：EFM3RHE01

设备地点/Location：东区薄膜III区/ East Thin Film Area III

工艺工程师/Engineer in response:

姓名：付学成；邮箱：xuecheng.f@sjtu.edu.cn；电话：34206126-6010

Name: XueCheng Fu；Email：xuecheng.f@sjtu.edu.cn; Tel: 34206126-6010.