高精度光电芯片耦合系统

（Flip-Chip Bonder ACCμRA OPTO）

主要用途/ Application：

高精度光电芯片耦合系统用于光电芯片、激光器芯片等的高精度倒装互连耦合工艺。支持各类芯片的冷压焊、回流焊、原位回流、无助焊剂共晶键合、热压键合等。键合介质可支持金、金锡、锡、锡银、铟、铜等；在压焊工艺中，能够实现上下芯片的独立温控。

Flip-Chip Bonder ACCμRA OPTO is the ideal equipment for optoelectronics and silicon photonics applications. The system is capable of various flip-chip bonding techniques, including reflow, fluxless eutectic bonding, thermocompression, and more. Bonding mediums supported include gold, gold-tin, tin, tin-silver, indium, copper, and others. During the bonding process, the system allows for independent temperature control of the upper and lower chips.

设备工作原理简介/ Operating principle：

高精度光电芯片耦合系统采用固定分光镜的视觉对位系统，实现芯片与基板的精确视觉对准，从而实现高精度键合/焊接。

Flip-Chip Bonder ACCμRA OPTO uses a visual alignment system with a fixed spectroscope to achieve precise visual alignment between the chip and the substrate, resulting in high post-bond accuracy.

工艺能力/ Capability：

互连精度：± 0.5 μm

键合压力：0.2～10N

温控范围：室温-400℃（焊臂），室温-400℃（承片台），分辨率1℃

芯片尺寸：0.25×0.25mm – 22×22mm（焊臂），

2×2mm – 50×50mm（承片台）

0.4×0.4mm to 20×20mm（正贴）

Post bonding accuracy：± 0.5 μm

Force range：0.2～10N

Heating range：Room temperature to 400℃（ARM），

Room temperature to 400℃（substrate），

resolution 1℃

Die size：0.25×0.25mm to 22×22mm（ARM），

2×2mm to 50×50mm（substrate）

0.4×0.4mm to 20×20mm (Face up)

典型使用案例/ Typical scenario：

ACCµRA OPTO 倒装焊精度可达±0.5μm，设备专用于低压力和回流焊工艺，工艺具有高度重复性，在光电子和硅光领域具有广泛的应用。

1、光电器件组装

2、多芯片组件

3、MEMS封装

图片来源于设备网站宣传图。

（Pictures are taken from the Internet.）

The ACCµRA OPTO is a Flip-Chip Bonder that permits to reach ± 0.5 μm post-bond accuracy. It is dedicated to low force and reflow processes. Its motorized axes guarantee a high repeatability. The ACCµRA OPTO is dedicated to optoelectronics and silicon photonics applications.

1、Photonics Packaging

2、MCM

3、MEMS

设备类别/Facilities：封装设备/ Packaging Equipment

设备编号/No.：EPK2EOC01

设备地点/Location：东区封装Ⅱ区/ East Packaging II Area

工艺工程师/Engineer in response:

姓名：刘丹；邮箱：liudanqh@sjtu.edu.cn 电话：021-34206126-6027

Name: Dan Liu; Email：liudanqh@sjtu.edu.cn Tel: 021-34206126-6027.