大压力芯片键合机

（Flip-Chip Bonder 150）

主要用途/ Application：

大压力芯片键合机支持各类芯片的冷压、热压回流、共晶工艺。设备具备倒装焊及正装焊功能，可实现芯片-芯片/芯片-晶圆等键合方式。设备可应用于芯片堆叠，3D集成，光电以及光子器件组装，MOEMS、 MEMS、 MCM等技术领域中。

The Flip-Chip Bonder 150 supports cold-compression, thermo-compression, reflow, and eutectic bonding for a wide range of chips. The system can achieve both flip-chip bonding and face-up bonding and can perform both chip-to-chip and chip-to-wafer bonding applications on the same open platforms. The system can be applied in chip stacking, 3D integration, opto-electronic and photonic device assembly, MOEMS, MEMS, MCM, and other applications.

 

设备工作原理简介/ Operating principle：

倒装焊技术是将芯片朝下通过凸点互连到基板、晶圆或者电路板上，形成稳定可靠的机械和电气连接。设备通过对芯片进行调平、对准和接合，具备芯片电极面朝下经钎焊、热压等工艺实现芯片凸点和封装基板互连的功能。

Flip-chip bonding is an interconnection technique used to assemble a chip to a substrate, wafer, or IC board, creating a secure mechanical and electrical bond. Through precise alignment and bonding processes, the system facilitates interconnection between the chip and the substrate or circuit.

 

工艺能力/ Capability：

互连精度：± 1-3 μm

键合压力：0.6～2000N，分辨率0.06N-2N

温控范围：室温-450℃（焊臂），室温-350℃（承片台），分辨率1℃

芯片尺寸：2×2mm – 50×50mm（焊臂），

2×2mm – φ200mm（承片台）

 

Post bonding accuracy：± 1-3 μm

Force range：0.6 to 2000N, sensitivity 0.06-2N

Heating range：Room temperature to 450℃（UBA），

Room temperature to 350℃（chuck），

resolution 1℃

Die size：2×2mm to 50×50mm（UBA），

2×2mm to φ200mm（chuck）

 

 

 

典型使用案例/ Typical scenario：

大压力芯片键合机具有芯片的精细平行度调整能力、大的键合压力和更高的键合精度，使其在光电及光子器件组装、焦平面器件、3D集成等领域具有广泛的应用。

1、焦平面阵列

2、射频领域

（以上照片均来源于倒装焊技术的网络应用资料，作为本设备的应用举例）

（The above photos are taken from the network application data of FC technology, as an example of the application.）

 

Flip-Chip Bonder150 has key benefits of precise adjustment of parallelism between dies，high bonding force，high bonding accuracy，which makes it widely used in optoelectronic and photonic device assembly, focal plane device, 3D integration and other fields.

1、Focal Plane Array

2、RF Applications

 

设备类别/Facilities：封装设备/ Packaging Equipment

设备编号/No.：EPK2FCB01

设备地点/Location：东区封装Ⅱ区/ East Packaging II Area

 

工艺工程师/Engineer in response:

姓名：刘丹；邮箱：liudanqh@sjtu.edu.cn 电话：021-34206126-6027

Name: Dan Liu; Email：liudanqh@sjtu.edu.cn Tel: 021-34206126-6027.

设备照片/Photos：