MOT电镀锡银

（MOT Electroplating system SnAg）

主要用途/ Application：

此设备主要用于锡银电镀。电镀锡银有良好的导电性、可焊性、抗腐蚀性和延展性，因此被广泛应用于半导体行业。例如，电镀锡银可以用于芯片封装中的引线键合和焊球连接，也可以作为导电材料应用于互连工艺，也可以用于芯片保护中的防腐蚀镀层。

This equipment is primarily used for electroplating SnAg. Electroplated SnAg offers excellent conductivity, solderability, corrosion resistance, and ductility, making it widely used as a solder material for wire bonding and solder ball bonding in chip packaging, as a conductive material in interconnect technology, and as an anti-corrosion plating for chip protection.

 

设备工作原理简介/ Operating principle：

锡银电镀是一种利用电化学方法在基体表面沉积锡层的工艺。其电镀液有锡盐、银盐、导电盐、pH调节剂等组成。清电镀过程中将基体作为阴极，通电后，锡离子在阴极表面还原析出，形成锡镀层。

Tin electroplating is a process that uses electrochemical reactions to deposit a layer of SnAg on the surface of a substrate. The electroplating solution consists of tin salts, silver salt, conductive salts, pH adjusters, and other components. During the electroplating process, the substrate is used as the cathode. After the current is applied, tin ions and silver are reduced and deposited on the surface of the cathode to form a tin coating.

 

工艺能力/ Capability：

10微米以上线宽；

1-20微米厚度；

Line width greater than 10 micrometers;

Thickness of 1-20 micrometers;

 

技术指标/ Specifications：

3、4、6寸标准尺寸晶圆。

晶圆厚度：350um-1000um

接受破片，尺寸小于150mm

3、4、6-inch size wafer.

Wafer thickness: 350um-1000um

Accepting fragments: smaller than 150mm

 

典型使用案例/ Typical scenario：

微凸点工艺：

• 光刻胶厚度 20um，形成孔径40um

电镀10-15um铜，再电镀5-10um锡

Micro-bump process:

• Photoresist thickness 20um, forming vias with diameter of 40um.

Electroplate 10-15um Cu, then electroplate 5-10um SnAg.

 

设备类别/Facilities：电镀/电铸系统设备/ Electroplating/Electrocasting System

设备编号/No.：EPL0SNP01

设备地点/Location：东区电镀区/ East Plating Area

 

工艺工程师/Engineer in response:

姓名：田苗；邮箱：miaotian@sjtu.edu.cn 电话：021-34206126-6031

Name: Miao Tian; Email：miaotian@sjtu.edu.cn Tel: 021-34206126-6031.

设备照片/Photos：