MOT电镀铜

（MOT Electroplating system Cu）

主要用途/ Application：

此设备主要用于铜电镀。电镀铜有良好的导电性稳定性和延展性且孔隙率低。被广泛应用于半导体互连工艺；也可以作为导电材料应用于和芯片保护中的防腐蚀镀层。同时也是广泛使用的一种预镀层，可用于改善镀层结合力。

This equipment is primarily used for electroplating Cu. Electroplated copper has good conductivity, stability, and ductility, as well as low porosity. Widely used in semiconductor interconnect processes, it can also be used as a conductive material for anti-corrosion coatings in chip protection. It is also a widely used pre coating that can be used to improve the adhesion of the coating.

 

设备工作原理简介/ Operating principle：

铜电镀是一种利用电化学方法在基体表面沉积铜层的工艺。其电镀液有硫酸铜、导电盐、pH调节剂等组成。电镀过程中将基体作为阴极，通电后，铜离子在阴极表面还原析出，形成铜镀层。

Copper electroplating is a process that uses electrochemical methods to deposit a layer of copper on the surface of a substrate. The electroplating solution consists of copper sulfate, conductive salts, pH adjusters, and other components. During the electroplating process, the substrate is used as the cathode. After the current is applied, copper ions are reduced and deposited on the surface of the cathode to form a copper coating.

 

工艺能力/ Capability：

10微米以上线宽；

0.5-20微米厚度；

Line width greater than 10 micrometers;

Thickness of 0.5-20 micrometers;

 

技术指标/ Specifications：

3、4、6寸标准尺寸晶圆。

晶圆厚度：350um-1000um

150mm尺寸以下异形样品（含破片）

3. 4. 6-inch size wafer.

Wafer thickness: 350um-1000um

Irregular samples (including fragments) with a size below 150mm

 

典型使用案例/ Typical scenario：

微凸点工艺：

• 光刻胶厚度 20um，形成孔径40um

电镀10-15um铜，再电镀5-10um锡。

Micro-bump process:

• Photoresist thickness 20um, forming vias with diameter of 40um.

Electroplate 10-15um Cu, then electroplate 5-10um Sn.

 

设备类别/Facilities：电镀/电铸系统设备/ Electroplating/Electrocasting System

设备编号/No.：EPL0CUP01

设备地点/Location：东区电镀区/ East Plating Area

 

工艺工程师/Engineer in response:

姓名：田苗；邮箱：miaotian@sjtu.edu.cn 电话：021-34206126-6031

Name: Miao Tian; Email：miaotian@sjtu.edu.cn Tel: 021-34206126-6031.

设备照片/Photos：