F&S引线键合机
（F&S BONDTEC 53XXBDA）
主要用途/ Application：
设备提供两种引线键合工艺：金丝球焊以及深楔键合。53xx BDA具有内置的电动Y轴。它可以通过编程生成一个完整的线径回路，以及线尾切断都是可编程的。
另外设备还提供了植球功能（Bumping）和连续线的引线键合。所有参数都被编程并保存在内部硬盘上，由LCD彩色显示屏，快速直观的显示和调用。
53XX BDA offers two bond processes on one bond-head: gold ball-bonding and deep-access wedge bonding. 53XX BDA is equipped with built-in motorized Y-axis. The entire bond loop can be programmed with with programmable tear-off function and tail definition.
Ball-bumping is also provided，including multiple wire function. All parameters are programmed and saved on the internal hard disk, shown a large LCD color display and controlled by a popular shuttle wheel, which is sensitive and direct to handle.
设备工作原理简介/ Operating principle：
引线键合是一种使用细金属线，利用热、压力、超声波能量为使金属引线与基板焊盘紧密焊合，实现芯片与基板间的电气互连和芯片间的信息互通。在理想控制条件下，引线和基板间会发生电子共享或原子的相互扩散，从而使两种金属间实现原子量级上的键合。
Wire Bonding use metal wires to bond metal leads and bond pads together by heat, pressure, and ultrasonic energyto realize electrical interconnection between chips and base plates and information exchange between chips. Under ideal conditions, electron sharing or atom diffusion occurs between the leads and the substrates, leading to bonding at atomic level between the two metals.
工艺能力/ capability：
- 芯片尺寸: 4寸以下
- 焊线直径：金线 17.5μm～75μm
- 热夹持台温度：室温～200℃（可调）
- 供线装置：1/2″线轴、2″线轴
- Chip size: within 110*110mm
- wire diameter: gold wire 17.5μm～75μm
- temperature of the heated holding table: room temperature to 200 ℃(adjustable)
- wire feeding device: 1/2 “bobbin, 2” bobbin
技术指标/ Specifications：
- 压焊头手控XY范围：18mm×18mm、步进精度2μm
- 压焊头手控Z行程：60mm、步进精度1μm
- 超声功率： 0～5W
- 程控压力：5～150cN
- XY range: 18mm * 18mm、step resolution 2μm
- Z axis: 60mm、step resolution 1μm
- ultrasonic power: 0 ~ 5W
- programmed pressure: 5～150cN
典型使用案例/ Typical scenario：
53XXBDA可以提供球焊、楔焊植球等封装工艺。
Machine 53XXBDA can provide wire-bonding、wedge-bonding and bumping processes in the assemble field.
设备编号/No.： WT1FWIB01
设备分类/ Facilities：封装设备/ Packaging Equipment
工艺工程师/Engineer in response:
电话：021-34207734-8024
Tel: 021-34207734-8024
设备照片/Photos：