Wafer mechanical thinning and dicing
Die Attach（DA）
Laser Ball Placement
Wire Bonding：Gold wire ball bonding (thermocompression bonding and thermosonic bonding), aluminum wire wedge bonding (thermosonic bonding and ultrasonic bonding).
Flip-Chip Bonding（D2D/D2W）
Electroplating：TSV-Cu， TGV-Cu、 RDL-Cu、SnAg、Thin/thick Au, electroplated Cu pillars with Sn caps followed by reflow, etc.
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: aemd@sjtu.edu.cn
