EN
EN
CN
Contact Us
Careers
Direction
Login
About Us
Facilities
Process Capabilities
Services & Products
User Guide
Home
About Us
返回
About Us
Platform Overview
Platform History
Staff
Staff Zone
Careers
Direction
Facilities
返回
Facilities
Micro-/Nano Fabrication
Packaging Processes
Characterisation & Testing
Process Capabilities
返回
Process Capabilities
Fabrication Processes
Testing & Characterisation
Process Integration
Services & Products
返回
Services & Products
Service Models
Supported Fields
Industry Engagement
Semi-Finishied-Products
Contract Manufacturing Services
User Guide
返回
User Guide
How to Become a User
EHS
Downloads
FAQs
Login
网站底部链接
返回
网站底部链接
服务平台链接
Login
Home
>
Process Capabilities
>
Fabrication Processes
>
Furnace Processing
Fabrication Processes
Furnace Processing
Patterning
Thin Film Growth & Deposition
Dry Etching
Furnace Processing
Wet Cleaning & Etching
Packaging
Patterning
Thin Film Growth & Deposition
Dry Etching
Furnace Processing
Wet Cleaning & Etching
Packaging
Furnace Processing
扩散掺杂
: 6
”及以下硅晶圆的硼扩散或磷扩散(包括预沉积和推进)
离子注入
:
8
”及以下基片的
B
、
P
、
As
、
Si
、
Ge
、
In
、
Ar
的离子注入掺杂(可批量加工),以及后续掺杂剂的高温激活
×