The system is designed for UV nanoimprint lithography processes, providing high-precision replication of nanoscale structures. It supports both working stamp fabrication and UV nanoimprint of high-resolution nanostructures. Fully automated working stamp replication, nanoimprinting, and demolding processes are available.

Process/Testing Capabilities

• Imprint resolution: ≤ 50 nm
• Pattern transfer accuracy: ≤ ±5% deviation from the original master mold
• Residual layer thickness: ≤ 20 nm
• Residual layer uniformity: ≤ ±10 nm
• Imprinted structure aspect ratio: ≥ 7.5:1
• Mold-to-substrate alignment accuracy: ≤ ±5 μm

Technical Specifications

• High-precision roller-based imprinting system provides the imprinting force, enabling conformal contact between the master wafer and the working stamp, or between the working stamp and the substrate wafer during precision rolling.
• Fully automated working stamp replication, nanoimprinting, and demolding.
• Imprint parameter range: Imprint pressure: 10,000–500,000 Pa， Imprint speed: 0.1–50 mm/s， UV exposure time: 0–3600 s
• Compatible substrate sizes: 2-inch, 100 mm, 150 mm, and 200 mm round substrates， Substrate thickness: 0.3–1.0 mm
• UV curing module: 365 nm LED area light source， Light intensity ≥1000 mW/cm²， Continuously adjustable intensity
• Exposure uniformity: ≥90% over the intensity range of 300–1000 mW/cm²