First, the ICP-RIE system introduces designated etching gases. Radio frequency power (typically 13.56 MHz) is applied to a conductive coil, which is generally mounted on the top of the plasma reaction chamber and isolated from the chamber internal gas atmosphere. When RF power passes through the coil, an oscillating electromagnetic field is generated around the conductor. The energy of this oscillating electromagnetic field is transmitted to the gas inside the reaction chamber via inductive coupling, exciting electrons in gas molecules and stripping them from atoms to produce free electrons and positive ions. These free electrons continuously gain energy in the electromagnetic field and collide with additional gas molecules, triggering further electron dissociation and ultimately forming high-density plasma.