| Model: | SM-200 |
|---|---|
| Function: | Primarily used for the spin coating process in photolithography; enables uniform coating of photoresist or other liquid materials, suitable for high-precision coating on wafers and substrates. |
| Engineer: | Zhang / +86-21-34206126-6029 / captianzhangdi@1 |
| Location: | East Area, Lithography IIIA Zone |
| Equipment ID: | EDD2SMS01 |
Used in photolithography spin coating processes to uniformly apply photoresist or other liquid materials, enabling high-precision coating on wafers and substrates.

1、Samples must be confirmed with process engineers in advance
2、Both frontside and backside of the samples must be flat and clean
Available all day. The sample must be confirmed with the process instructor in advance. Both the front and back surfaces of the sample must remain flat and clean. Do not touch the sample directly with your hands before use.
The waste liquid container needs to be replaced