EBPG 5200 Electron-beam lithography system

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Electron Beam Direct Write Lithography System (EBL)

Repair

Model：	EBPG 5200
Function：	Direct-write lithography for nanoscale structures on substrates up to 8 inches
Engineer：	Xu / +86-21-34206126-6018 / xu.jian@1
Location：	West Area, Lithography Zone I
Equipment ID：	WPHVEBL01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Applications

Exposure of nanoscale patterns for micro/nano device fabrication. Suitable for various nanostructures and devices, photomasks, nanoimprint templates, etc.

Process/Testing Capabilities

Minimum measured linewidth: ≤8 nm
Minimum overlay/ stitching accuracy: ±12 nm
Maximum write field: 1 mm× 1 mm

Technical Specification

Maximum accelerating voltage: 100 kV
Maximum scanning speed: 50 MHz
Beam current: 0.1 nA – 100 nA
Minimum beam spot diameter: ≤3 nm
Electron beam addressing DAC: 20 bits (main field) & 14 bits (subfield)

The principle of electron beam lithography is based on the interaction between electrons and matter. Electromagnetic lenses at various stages deflect and focus the electron beam emitted from the electron source. A beam blanker controls the on/off switching of the beam, enabling pattern scanning onto the wafer.

LNO modulator

Sub-100 nm 2D grating

Material Type: Standard semiconductor silicon wafers suitable for vacuum environment; non-magnetic materials:
Si, GaAs, GaN, GaP, metal-coated glass
Substrate Dimensions: 2", 3", 4", Φ125 mm, Φ150 mm, Φ200 mm
Thickness: Max. 0.675 mm
Non-standard substrates must be ≥10 mm × 10 mm
Photomask (chrome mask) dimensions: 3", 4", 5", 6", 7"
Thickness: Max. 0.09" @ 5" mask
Max. 0.25" @ 6" mask
Direct-write pattern area: Up to ~210 mm × 210 mm
Substrate flatness:
Max. ±30 μm peak-to-peak (without alignment marks)
Max. ±50 μm peak-to-peak (with alignment marks)
(For non-standard substrates with special thickness, three additional samples of the same thickness are required for height reference.)

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Photoresist types

PMMA, CSAR62 (HSQ, ZEP can be provided by user)
02

How to reserve the equipment?

Check the reservation notice on the platform homepage.

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