303DU hotplate

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Ordinary hot plate

303DU hotplate

Operating

Model：	303DU hotplate
Function：	Photoresist baking
Engineer：	Wang,Zhang / +86-21- 34206126-6005/6029 / fdwang@1/captianzhangdi@1
Location：	East Area, Lithography IIIA Zone; West Area, Lithography I Zone
Equipment ID：	ELT3PHP01、ELT3PHP02、ELT3PHP03、ELT3PHP04、WPHDHTP01、EPHSHTP01、EODBHTP01

Reservation

Basic Equipment Information

Main Application

Photoresist baking

Process / Testing Capabilities

Photoresist baking

Technical Specifications

Temperature Range: Ambient Temperature – 250°C
Temperature Accuracy: ≤ ± 1%

Standard semiconductor silicon wafers or glass wafers, sample size ≤ 8"

Inspect the equipment status prior to use and exercise caution when placing samples to avoid scalding by the hot plate that has not cooled down completely from the previous use. The photoresist on the edges and back of the sample must be thoroughly removed before placing the sample on the hot plate for thermal processing, to prevent contamination of the hot plate by residual photoresist. Scraping or scratching the coating on the hot plate surface with hard materials such as metal is strictly prohibited. Turn off the hot plate in a timely manner after use.

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FAQs

01

开机后设备出现乱码

请重启设备

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