Laurell Spin-coater

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Spin Coater

Laurell Spin-coater

Operating

Model：	Spin-coater
Function：	1.Photoresist spin coating ; 2.Spin coating of flexible substrate precursor materials
Engineer：	Wang,Zhang / +86-21- 34206126-6005/6029 / fdwang@1/captianzhangdi@1
Location：	East Area, Lithography IIIA Zone; West Area, Lithography I Zone
Equipment ID：	ELT3SPC01、WPHSCOT02、WPHSCOT01、EPHKCOT01

Reservation

Basic Equipment Information
Operating Principle

Main Applications

Uniformly coat photoresist onto substrates using the spin coating method.

Process / Testing Capabilities

Spin coating of photoresist for wafers up to 6 inches.

Technical Specifications

Rotation speed: 100–12,000 rpm
Acceleration: 1–12,000 rpm/sec (no-load)

The spin coater operates by uniformly distributing photoresist onto the substrate through high-speed rotation.

Semiconductor standard silicon wafers or glass substrates
Fragments smaller than 1" (minimum 10 mm × 10 mm), standard wafers: 2", 3", 4", 6"

Check the equipment status before use and ensure proper sample placement. After spin coating, thoroughly clean the chamber immediately. Cleaning may also be performed after each session if it does not interfere with other scheduled users. Typically, use lint-free wipes soaked in acetone to remove photoresist residues

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Wafer cannot be properly held by vacuum during operation

Clean the chuck surface and the backside of the wafer promptly

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