| Model： | 101 Spray Coater |
|---|---|
| Function： | Photoresist spin coating and spray coating in semiconductor lithography processes. |
| Engineer： | Wang / +86-21-34206126-6005 / fdwang@1 |
| Location： | East Area, Lithography Zone III A |
| Equipment ID： | WPHESPC01 |
Photoresist spin coating and spray coating in semiconductor lithography processes.
Substrate size: Supports 2, 3, 4, 6, 8-inch substrates as well as broken pieces for spray coating.
The working principle of the spray coater is to uniformly spray photoresist onto the substrate by rotating the substrate. Through high rotation speed and high rotation acceleration, high film thickness uniformity is achieved on the substrate.
Supports 2" to 8" standard wafers, as well as fragments larger than 10 mm × 10 mm.
Before use, check the equipment status and pay attention to sample placement. Immediately after spin coating, thoroughly clean the chamber. If it does not affect other users’ reservations, cleaning can be performed at the end of each experiment before leaving. Generally, use acetone with lint-free wipes to wipe and clean the photoresist residues.
Please clean the chuck and the backside of the piece in a timely manner.
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: aemd@sjtu.edu.cn
