RCD8

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High-Performance Developer

RCD8

Operating

Model：	RCD8
Function：	Spray-type development
Engineer：	Wang / +86-21- 34206126-6005 / fdwang@1
Location：	East Area, Lithography IIIA Zone
Equipment ID：	ELT3RCD81

Reservation

Basic Equipment Information
Operating Principle

Main Applications

After exposure, wafers are processed in the developer using a developing solution to remove selected regions of photoresist.

Process / Testing Capabilities

Spin coating and spray-type development for wafers up to 8 inches. Supports backside rinse and edge bead removal (EBR) .

Technical Specifications

Motor precision: 3000 rpm ±1 rpm

Development is the process of placing exposed wafers into the developer and applying a developing solution to remove either exposed or unexposed photoresist, depending on the process type.

Supports standard wafers from 2” to 8”. Supports fragments larger than 10 mm × 10 mm

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Wafer cannot be properly held by vacuum during operation

Clean the chuck surface and the backside of the wafer promptly

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If your question is not listed above, please email us at aemd@sjtu.edu.cn or click the button below to submit an inquiry.

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