MCS8

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High-Performance Spin Coater

MCS8

Operating

Model：	RCD8
Function：	Photoresist spin coating for wafers up to 8 inches
Engineer：	Wang / +86-21-34206126-6005 / fdwang@1
Location：	East Area, Lithography IIIA Zone
Equipment ID：	ELT3MCS81

Reservation

Basic Equipment Information
Operating Principle

Main Applications

Uniformly coat photoresist onto substrates using the spin coating method.

Process / Testing Capabilities

Spin coating of photoresist for wafers up to 8 inches. Supports backside rinse and edge bead removal (EBR). Compatible with photoresists ranging from <1 cps to 55,000 cps viscosity.

Technical Specifications

Maximum rotation speed: up to 10,000 rpm
Acceleration: up to 7,000 rpm/sec
Equipped with GYRSET technology for handling broken or irregular samples

The spin coater operates by uniformly spreading photoresist onto the substrate through high-speed rotation.

Supports standard wafers from 2” to 8”. Supports small pieces larger than 10 mm × 10 mm.

Check the equipment status before use and ensure proper sample placement. After spin coating, thoroughly clean the chamber immediately. Cleaning may also be done after each session if it does not interfere with other scheduled users. Typically, use lint-free wipes soaked in acetone to clean photoresist residues

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Wafer not adsorbed on the chuck; vacuum alarm displayed

The backside of the wafer or the chuck surface may be dirty. Clean both surfaces with anhydrous alcohol and reposition the wafer.

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