Automatic Coater/Developer(TRACK)
auto clean track
Operating
Model: ACT8
Function: Fully automatic coating and developing for 180 nm semiconductor process node
Engineer: Xu / +86-21-34206126-6052 / hui.xu25951@1
Location: East Area, Lithography Zone II (Canon)
Equipment ID: ELT2ACT01
  • Basic Equipment Information
  • Operating Principle
  • Typical Application Case
Main Applications

Supports HMDS hydrophobic modification, photoresist spin coating, soft bake, PEB (post-exposure bake), puddle static developing, post bake, etc. for 4/6/8-inch standard semiconductor wafers. Supports fully automatic coating, exposure, and developing processes for 6/8-inch wafers with Canon DUV Stepper.

 

Process / Testing Capabilities

Film thickness uniformity accuracy ≤1%; within-wafer CD uniformity after developing (CDU) 3σ ≤10%; hot plate temperature range: 50°C ~ 350°C.

1.Pre-coating hydrophobic modification using HMDS (hexamethyldisilazane).
2.Photoresist spin coating and edge bead removal; adjustable film thickness and controllable edge bead removal width.
3.Soft bake / PEB / hard bake; multiple hot plate options, temperature range 50°C ~ 350°C, high accuracy.
4.Developing using static puddle process; SH nozzle and LD nozzle provide high flow rate with low impact. After developing, DIW and high-speed spin rinsing are used to dry the wafer surface.
5.High-speed chill plate cooling: wafer temperature can be lowered to 23°C within 60 seconds.
6.Fully automatic processing; the above functions can be combined according to process requirements, or each function can be used individually.
7.HMDS – coating – soft bake – cooling: 7 min/wafer.
8.PEB – cooling – developing – hard bake – cooling: 8 min/wafer.

8-inch standard semiconductor wafers (for 4/6-inch wafers, please contact the relevant engineer).

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.
FAQs
  • 01
    Changeover cycle for 4/6/8-inch sizes?

    Switching between different wafer sizes requires 2 weeks. Please check the website or AEMD platform announcements for current equipment status.

  • 02
    Requirements for photoresist?

    The resist pump only supports low-viscosity photoresists; thick resists are not supported.

  • 03
    Does it support transparent wafers?

    No.

  • 04
    Does it support broken pieces or square pieces?

    No. Only supports 4/6-inch flat wafers and 8-inch notch wafers.

Message Inquiry
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