Plasma-Therm Technical Workshop:
Fundamentals of Plasma Processing (Etching and Deposition)
April 25, 2014 (Friday), 8:00am to 5:30pm
Room 3-200 SEIEE Building, 800 Dong Chuan Rd, Shanghai
地址:上海市闵行区东川路800号电院群楼3号楼200室
The workshop will focus on the fundamentals of plasma etching and deposition. Lectures will include the basics of plasma reactors and mechanisms for etching and deposition and review state-of-the-art etching and deposition technologies as applied to semiconductor, MEMS, and nanofabrication. Talks will cover compound semiconductor, dielectric, and deep silicon etching as well as PECVD and high density plasma CVD of silicon based materials. Fundamental and new ideas for endpoint detection and sample thermal budget management will be presented.
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Learn the fundamentals of plasma, reactors, and etching mechanisms
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Review current etching technologies for deep silicon etching, compound semiconductors, and dielectrics
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Provide essentials of PECVD and HDPCVD
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Explore the fundamentals and new ideas in endpoint detection
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Understand thermal budget considerations