DISCO BG810减薄机

（DISCO BG810 Grinder）

主要用途/ Application：

用于8寸及以下的晶圆（SOI、SI、玻璃、铜片等其他半导体材料）减薄，厚度精准度可达到2um以内，该设备将为后期的封装工艺提供便利。

For back grinding wafers with diameters of 8 inches and less (SOI, SI, glass, copper and other semiconductor materials). The thickness accuracy can be less than 2um. This equipment facilitates packaging process.

 

设备工作原理简介/ Operating principle：

通过真空吸盘使得晶圆固定在工作台面上，环形金刚石磨轮工作面的内外圆周中线调整至硅片中心位置。晶圆和磨轮绕着各自的轴线回转，进行切入磨削，使得晶圆背面被均匀减薄，实现减薄工艺。

The wafer is fixed on chuck table by a vacuum sucker, and the center lines of the inner and outer circumference of the ring diamond grinding wheel working face are adjusted to the center of the silicon wafer. The wafer and grinding wheel rotate around their own axes, and cut-in grinding is carried out, so that the back of the wafer is evenly thinned.

 

工艺能力/ capability：

1. 晶圆尺寸：8寸及以下（含不规则）
2. 晶圆材料：SOI、SI、玻璃、铜片等其他半导体材料（具体咨询相关工艺工程师）
3. 减薄平整度：<2um
4. 减薄粗糙度：Ry=0.012mm
5. 减薄厚度偏差：<20um

1. Wafer size: 8 inches or less (including irregularities)
2. Wafer materials: SOI, SI, glass, copper and other semiconductor materials
3. TTV:<2um
4. Ry：012mm
5. Deviation of BG thickness: <20um

技术指标/ Specifications：

1. 磨轮转速：1000-7000rpm
2. 工作台转速：0-300rpm
3. 输出功率：2kw
4. Y轴加工行程：<430mm
5. Y轴进刀速度: 0.01-50mm/s
6. Y轴最小位移量:1um

1. Spindle speed: 1000-7000rpm
2. Chuck table speed: 0-300rpm
3. Output power: 4.2 kw
4. Y-axis stroke: <430mm
5. Y-axis feed speed: 0.01-50mm/s
6. Y-axis minimum displacement: 1um

典型使用案例/ Typical scenario：

8寸光片背面减薄图示

8’mirror wafer back grinding as below photo

设备编号/No.： WT1DDBG01

设备名称/Name： DISCO BG810减薄机/ DISCO BG810 Grinder

设备类别/ Facilities：封装设备/ Packaging Equipment

 

工艺工程师/Engineer in response:

电话：021-34207734-8024

Tel: 021-34207734-8024

 

设备照片/Photos：