Denton多靶磁控溅射镀膜系统

Denton多靶磁控溅射镀膜系统 （Denton Multi-target Magnetic Control Sputtering System） 主要技术指标/Specifications: 极限真空：优于5´10-7Torr Ultimate vacuum: better than 5´10-7Torr 镀膜均匀性与重复性：6英寸衬底均匀性优于±3 % ，重复性优于±2.0% Uniformity & Repeatability: Thickness non-uniformity less than ±5% on 6″ wafer; repeatability better than ±2% 靶材：3个3英寸靶位；2个DC源和1个RF源 Target: three 3” target; two DC power and one RF power 基片尺寸：支持6英寸以下兼顾5、4、3、2英寸以及破片 Substrate size:  6″, 5”, 4”, 3” and below; pieces. 具备防交叉污染的挡板。…

Denton电子束蒸发镀膜设备

Denton电子束蒸发镀膜设备 （Denton Electron Beam Evaporator） 主要技术指标/Specifications: 极限真空：优于1´10-7Torr Ultimate vacuum :<1´10-7Torr 镀膜均匀性与重复性：6英寸衬底均匀性优于±3% ，重复性优于±2.0%；Uniformity & Repeatability: Thickness non-uniformity less than ±3% on 6″ wafer, repeatability better than ±2% 可配备石墨、钨、钼衬埚，容量18cc. Mo crucible liners and Graphite crucible liners with volum 18cc 可以加工的衬底尺寸：6 英寸以下兼顾5、4、3、2英寸以及破片 Manual tilted substrate stage able to hold maximum one 6″ wafer 工件台偏转角度±45°可调，可做倾斜蒸发。 Max. substrate stage tilt…