PVA-TePla微波等离子去胶机/表面处理机

(PVA-Tepla Microwave Stripper /Plasma processing system)

主要技术指标/Specifications:

  1. 腔体尺寸：直径248mm*245mm深

Chamber size: diameter248mm*deep245mm

  1. 电源频率及功率：2.45GHz,600W

RF Generator：2.45GHz，600W

  1. 基片尺寸：8寸并向下兼容6、5、4、3、2英寸等以及破片

substrate size: Up to 8inch, applicable to 6, 5, 4, 3, 2 inch and broken pieces

  1. 气体配备：O2、N2极限真空：<1´10–7Torr

Gas: O2, N2； Base pressure: <1´10–7Torr

主要用途/Applications:

        光刻胶去除及表面改性与清洁

        Photoresist stripping, surface modification and cleaning with plasma.

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