Denton电子束蒸发镀膜设备

（Denton Electron Beam Evaporator）

主要技术指标/Specifications:

  1. 极限真空：优于1´10-7Torr

Ultimate vacuum :<1´10-7Torr

  1. 镀膜均匀性与重复性：6英寸衬底均匀性优于±3% ，重复性优于±2.0%；Uniformity & Repeatability: Thickness non-uniformity less than ±3% on 6″ wafer, repeatability better than ±2%
  2. 可配备石墨、钨、钼衬埚，容量18cc.

Mo crucible liners and Graphite crucible liners with volum 18cc

  1. 可以加工的衬底尺寸：6 英寸以下兼顾5、4、3、2英寸以及破片

Manual tilted substrate stage able to hold maximum one 6″ wafer

  1. 工件台偏转角度±45°可调，可做倾斜蒸发。

Max. substrate stage tilt angle: ±45°and can be used for tilted evaporation

主要用途/Applications:

        蒸发沉积Au, Pt, Al, Ti, Cr, Ni, Ag, V, Ti，W, ITO, AlN, SiO2, PZT等薄膜。

Evaporating deposit metal or dielectric films, such as Au, Pt, Al, Ti, Cr, Ni, Ag, V, Ti，W, ITO, AlN, SiO2, PZT etc.

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