About Center for Advanced Electronic Materials and Devices (AEMD)
Profile of AEMD
Center for Advanced Electronic Materials and Devices (AEMD) of Shanghai Jiao Tong University （SJTU） was invested by the ‘985 Project’ of the Ministry of Education. AEMD including West Lab and East Lab is located on the Minhang campus of SJTU in Shanghai. The center has built a university-level micro-and nanofabrication and testing platform, offering the service on many aspects of cleanroom process technology and device fabrication, which facilitates the state-of-the-art research on semiconductor materials and devices, optoelectronic materials and devices, MEMS/Bio-MEMS technologies, and IC chip packaging technologies, etc.
The center is equipped with advanced Micro/Nanofabrication facilities for wafer cleaning, lithography, thermal processing, thin film deposition, dry/wet etching, packaging and characterization, within about 1600 m2 of class 100-10000 cleanroom. AEMD can fabricate on silicon, glass, and polymer substrates with feature size down to 10 nm on substrates up to 6 inch in size. Some tools in the lines can provide 8-inch fabrication services. AEMD is designed to integrate a 3-inch ~ 6-inch wafer scale semiconductor level experimental line in the west laboratory, and a 3-inch ~ 4-inch non-silicon-base/MEMS Micro/Nanofabrication experimental line in the east laboratory.
AEMD provides a cooperation and communication platform for different research fields and a practice base for high level talents’ training. The center is also opened to the academic affiliates and industry outside SJTU on related project cooperation and micro- and nanofabrication services.
Service Concept
SIIS：Service-Interaction-Innovation-Satisfaction
Service Modes
- Training and use of equipment in cleanroom facilities for internal customer @SJTU
- Outsourcing Micro/Nanofabrication and testing
- Projects co-development with companies
- Micro/Nanostructures, Wafers and other Customized Products
Brief introduction on AEMD facilities
Nanoscale Fabrication: e-beam lithography, thermo-compressing/UV nano-imprinter,
dual-beam focused ion beam system(FIB).
Lithography: double-side alignment UV aligner (3 sets), spin-coating and developing system, plasma Photo-resist stripper (3 sets).
Thermal Processing: wet/dry oxidation furnace (2 sets), boron diffusion furnace, phosphorous diffusion furnace, polysilicon LPCVD, Si3N4 LPCVD, rapid thermal processing tool (RTP, 2 sets), high temperature annealing furance, etc.
Thin film deposition: multiple-target sputtering system (4 sets), e-beam/thermal evaporator (E-gun, 2 sets), ion beam sputter, plasma enhanced CVD (PECVD),,etc.
Dry etching: ion beam milling, reactive ion etcher (RIE-metal), reactive ion etcher (RIE-dielectrics), deep-silicon reactive ion etching system (Deep-RIE, 2 sets);
Wet cleaning and etching: RCA standard cleaning bench (2 sets), organic cleaning bench, micro electro-casting/plating system, etc.
Characterization: field-emission scanning electron microscope (FE-SEM), atomic force microscope (AFM), semiconductor parameter tester, Hall effect tester, surface profiler, UV film thickness tester, four-point prober, etc.
Other equipment: OLED device fabrication system, substrate grinding and polishing system, die sawing tool, etc.
More information please visit https://aemd.sjtu.edu.cn/en/equipment/