OLED器件实验制备系统
(OLED Device Preparation System)
主要技术指标/Specifications:
- 配置:1个热蒸发腔室、1台UV固化设备(365nm)及1氮气手套箱,可实现OLED多层膜制备与器件封装
Configuration: one thermal evaporation chamber, one UV solidification tool, one glove-box with N2 protection for multi-layer preparation and package of OLED devices
- 蒸发源:7个OLED有机分子热蒸发源(如NPB、ALQ等),3个金属源(如Al, Ag, Au等)
Evaporation sources: 7 OLED organic sources (e.g., NPB, ALQ, etc.), 3 metal sources (e.g., Al, Ag, Au, etc.)
- 蒸发腔室极限真空度:5´10-6 Torr
Ultimate vacuum of evaporation chamber: 5´10-6 Torr
- 蒸发膜厚均匀性 : ±5%
Evaporation film non-uniformity: ±5%
- 基片尺寸:3´3cm 及以下
Substrate size: 3´3cm and below
主要用途/Applications:
仅限用于OLED器件薄膜制备与器件封装
Only used for the film stack’s preparation and packaging of OLED devices.