紫外双面光刻机

（EVG610 Double-Sided Lithography System）

主要用途/ Application：

EVG610是一款多功能的光刻和键合设备，广泛应用于半导体制造、微机电系统（MEMS）、先进封装和微流控器件的生产。它主要用于紫外光刻、光刻胶涂覆、显影和晶圆键合等工艺，适合进行精密图形的制备和高质量的晶圆对准。EVG610支持多种尺寸的晶圆操作，能够进行热压键合、阳极键合和分子键合等多种键合技术，实现高精度的工艺控制，满足科研机构和生产线对多功能光刻与键合设备的需求

The EVG610 is a versatile lithography and bonding system widely used in semiconductor manufacturing, micro-electromechanical systems (MEMS), advanced packaging, and microfluidic device production. It is primarily utilized for UV lithography, photoresist coating, development, and wafer bonding processes, making it suitable for the preparation of precise patterns and high-quality wafer alignment. The EVG610 supports various wafer sizes and can perform different bonding techniques, including thermocompression bonding, anodic bonding, and molecular bonding, ensuring high-precision process control. It meets the needs of research institutions and production lines requiring multifunctional lithography and bonding equipment.

设备工作原理简介/ Operating principle：

EVG610的工作原理主要围绕光刻和晶圆键合两个核心工艺展开。以下是其基本工作原理的简要说明：

光刻工艺：

EVG610通过将紫外光（UV）照射到涂覆在晶圆表面的光刻胶上，光刻胶的受光区域发生化学变化，从而在晶圆上形成图案。其光刻系统可提供高精度的曝光对准，支持各种光刻胶的涂覆和显影操作。

设备可以进行多层图形曝光，并实现精密对准，用于制造复杂的微纳结构，如半导体器件、微机电系统（MEMS）和光子器件。

晶圆键合工艺：

EVG610支持多种晶圆键合技术，包括热压键合、阳极键合和分子键合等。

在键合过程中，设备先将两块晶圆精密对准，再通过施加压力和/或热量使其表面紧密接触，以实现高质量的键合。这些方法可以形成气密性良好的接合界面，适用于不同的材料组合，如硅、玻璃、金属等。

整体来说，EVG610通过精密的光学、热学和机械系统，实现高精度的光刻和晶圆键合操作，适用于科研和工业的多种应用需求

The working principles of EVG610 mainly revolve around two core processes: lithography and wafer bonding. Here is a brief explanation of its basic working principles:

Lithography Process: The EVG610 uses ultraviolet (UV) light to irradiate the photoresist coated on the wafer surface, causing chemical changes in the exposed areas of the photoresist, which in turn forms patterns on the wafer. Its lithography system provides high-precision exposure alignment, supporting the coating and development of various photoresists. The equipment can perform multi-layer pattern exposure with precise alignment, suitable for fabricating complex micro- and nano-structures, such as semiconductor devices, micro-electromechanical systems (MEMS), and photonic devices.
Wafer Bonding Process: The EVG610 supports various wafer bonding techniques, including thermocompression bonding, anodic bonding, and molecular bonding. During the bonding process, the device precisely aligns two wafers and then applies pressure and/or heat to bring the surfaces into close contact, achieving high-quality bonding. These methods can form hermetically sealed interfaces, making them suitable for different material combinations, such as silicon, glass, and metals.

Overall, the EVG610 achieves high-precision lithography and wafer bonding operations through its sophisticated optical, thermal, and mechanical systems, meeting the diverse application needs in research and industrial settings.

工艺能力/ Capability

1、6“以下晶圆及碎片双面光刻图形化

2、图形最小分辨率可至0.8um

3、配合晶圆键合系统提供高精度键合晶圆及芯片对准。

4、可配套EVG-510键合机实现晶圆对准、定位功能。

1、Double-sided lithography for wafers below 6 inches and wafer fragments.

2、The minimum resolution of patterns can reach 0.8 µm.

3、Provides high-precision alignment of wafers and chips in conjunction with wafer bonding systems.

4、Can be integrated with the EVG-510 bonder to achieve wafer alignment and positioning functions.

技术指标/ Specifications：

配置LED 365nm光源
曝光功率≥18 mW/cm²，调节范围20-100%
直径为6英寸范围内，光强均匀性≤3%
曝光接触方式包括硬接触、软接触、真空接触和接近式
曝光模式包括恒定时间，恒定剂量，恒定强度，恒定功率
最小分辨率≤ 1 μm
5倍和10倍物镜
正面套刻精度≤±0.5μm
背面套刻精度≤±2μm
键合对准精度≤±5μm

Equipped with LED 365nm Light Source
Exposure Power ≥ 18 mW/cm² with Adjustable Range of 20-100%
Light Intensity Uniformity ≤ 3% within a 6-Inch Diameter Area
Exposure Contact Modes Include Hard Contact, Soft Contact, Vacuum Contact, and Proximity Contact
Exposure Modes Include Constant Time, Constant Dose, Constant Intensity, and Constant Power
Minimum Resolution ≤ 1 μm
5x and 10x Objectives
Front Alignment Accuracy ≤ ±0.5 μm
Back Alignment Accuracy ≤ ±2 μm
Bonding Alignment Accuracy ≤ ±5 μm

典型使用案例/ Typical scenario：

设备类别/Facilities：光刻/图形化设备/ Lithography/Patterning Equipment

设备编号/No.：ELT2DLS01

设备地点/Location：东区光刻 Ⅱ区(Canon)/ East Lithography II Area (Canon)

工艺工程师/Engineer in response:

姓名：张笛；邮箱：captianzhangdi@sjtu.edu.cn；电话：13651735947

Name: Di Zhang；Email：fdwang@sjtu.edu.cn; Tel: 13651735947.