研磨减薄机
(Grinding and Thinning Machine)
主要技术指标/Specifications:
Substrate size: 3”
Lapping speed:200rpm
主要用途/Applications:
可对硅,氧化硅,陶瓷,金属等硬材料进行表面研磨与减薄
Grinding or thinning of silicon, SiO2, ceramic, metal or other hard materials.